Pb-Free and RoHS Compliance
The European Union has adopted Directive 2002/95/EC, Restrictions of Hazardous Substances ("RoHS"), effective July 1, 2006. Pb-free is defined as compliant with RoHS standards, including a Pb concentration that does not exceed 0.1% of product weight in homogeneous material.
Kinetic's entire product line is compliant with RoHS standards. All of the company's products meet RoHS thresholds for cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs), and polybrominated diphenyl ethers (PBDEs). Please refer to the table below for a list of RoHS Restricted Compounds and the acceptable thresholds specified by the European Commission. Also for reference, the Plating Material Composition Table below provides a list of the plating material used for each package offered by Kinetic.
|Substance||RoHS Max Concentration||Kinetic Status|
|Lead (Pb)||0.1% per weight||100% Compliant|
|Cadmium (Cd)||100ppm||100% Compliant|
|Mercury (Hg)||0.1% per weight||100% Compliant|
|Hexavalent Chromium (Cr+6)||0.1% per weight||100% Compliant|
|Polybrominated Biphenyls (PBB)||0.1% per weight||100% Compliant|
|Polybrominated Diphenyl Ethers (PBDE)||0.1% per weight||100% Compliant|
Plating Material Composition
|TDFN22/TDFN23/TDFN33||Matte Tin (Sn) or NiPdAu|
|TQFN33/TQFN34/TQFN44||Matte Tin (Sn) or NiPdAu|
|TSOT3||Matte Tin (Sn) or NiPdAu|
|SOT23||Matte Tin (Sn) or NiPdAu|
|ETSSOP/HSOP/SSOP/TSSOP/SOP||Matte Tin (Sn)|
Tin Whisker Testing and Qualification
Kinetic has conducted extensive qualification tests to ensure reliability of Pb-free packages, including tin whisker tests with the following conditions:
The results of these tests showed the packages to be reliable and had whisker growth less than the industry acceptable size of 50 microns.
Green Molding Compound
Kinetic defines "Green" to be fully RoHS compliant, as well as free of Halogen and Antimony (Sb), used as flame retardants in package molding compounds. 100% of Kinetic encapsulated semiconductor products are using Green molding compound
|Substance||Green Max Concentration||Kinetic Status|
|Halogen (Cl + Br)||1500ppm||100% Compliant|
|Bromine (Br)||900ppm||100% Compliant|
|Chlorine (Cl)||900ppm||100% Compliant|
|Antimony (Sb)||900ppm||100% Compliant|
Pb-free and Green Part Number Ordering
All existing Kinetic part numbers refer to Pb-free and Green devices.
The peak solder reflow temperature for Pb-free is 260°C, which is backward compatible with JEDEC standard 240°C peak temperature for Pb devices.